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The two major South Korean DRAM manufacturers are each preparing to discontinue their older DDR4 production lines. Following ...
Tom's Hardware on MSN3d
3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per moduleNEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM ...
The Chosun Ilbo on MSN3d
Samsung, SK hynix move toward hybrid bonding for next-gen HBMSamsung Electronics and SK hynix are considering adopting hybrid bonding technology for next-generation high-bandwidth memory ...
The South Korean chip maker's proposed $3.87 billion manufacturing campus in Indiana is still on track after the West ...
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