Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.

Today, Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) ...

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Samsung Electronics Co.’s shares rose after Nvidia Corp. founder Jensen Huang expressed confidence in the Korean company’s ...

Micron’s data center revenue surged 4X YoY and 40% sequentially in Q1-FY25, contributing 55% of consolidated revenue. High ...

Micron Technology initiated construction on (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging ...

SK Hynix Inc’s parent SK Group chairman Chey Tae-won, and Nvidia Corp cofounder Jensen Huang (黃仁勳) met on Wednesday to ...

Talk about artificial intelligence and you immediately think about Nvidia (NASDAQ:NVDA), Broadcom (NASDAQ:AVGO), or even ...

Mizuho analysts project a positive 2025 for chipmakers, supported by robust artificial intelligence (AI) demand, data center ...

Nvidia’s CEO Jensen Huang expressed confidence that Samsung will overcome challenges in producing high-bandwidth memory chips ...

Explore the NVIDIA GeForce RTX 5090: unmatched power, advanced cooling, and next-gen connectivity for gamers and ...