A leaker is detailing the new A20 chip, expected to be available with the iPhone 18. Here's why it will be another major breakthrough tech.

AMD put out a release yesterday, justifiably crowing that one if its EPYC "Venice" processors was the first HPC product to ...

The new wafer fabrication facility in Arizona will ... produced using TSMC’s N3/N3E process and a platform controller die based on TSMC’s N6 process. Intel’s Nova Lake processors ...

These cores are arranged together on a die, sliced from a wafer of silicon-based semiconductor material. Before we get into specific CPU recommendations, let's build an understanding of what ...

Good morning, good afternoon, ladies and gentlemen, and welcome to Besi Quarterly Conference Call and Audio Webcast to discuss the company's 2025 first quarter results. You can register for the ...

The Kirin 9020 appears to have been using a wafer integration system similar to Apple’s, packaging the chip on a single die with memory stacked above the CPU. As the overall thickness has ...

Large die will have lower yield ... "Yield" is how much of a wafer is usable for chips. But, as Gelsinger points out, the very same fabrication process can yield vastly different yields (sorry ...

Today, a story of #HOPE for the people of Hillsboro, Oregon, INTEL Corp, and anyone who loves a great comeback ...

We have new packaging technologies including BSPDN (Backside Power Delivery) which will move the power delivery process to the backside of the wafer ... and a dummy die. Intel's new Core Ultra ...

SK Group is looking to sell its majority stake in semiconductor wafer manufacturer SK Siltron, according to South Korean media reports citing industry sources. The conglomerate has reportedly been ...