A new technical paper, “Exploring Silent Data Corruption as a Reliability Challenge in LLM Training,” was published by ...

A new technical paper, “Neural Computers,” was published by researchers at Meta AI and KAUST. Abstract “We propose a new ...

A new technical paper, “Characterizing tip-sample interaction dynamics on extreme ultraviolet nanostructures using atomic ...

A new technical paper, “Photonic chip packaging for extreme environments” was published by NIST, Johns Hopkins and University ...

A new technical paper, “Role of surface states and band modulations in ultrathin ruthenium interconnects,” was published by ...

A new technical paper, “A comparative study on power delivery aspects of compute-in/near-memory approaches using DRAM,” was ...

Towards 100 Million IOPS SSD Emulation for Next-generation GPU-centric Storage Systems,” was published by KAIST. Abstract ...

Intel teams up everywhere; GPU rowhammer attack; fast verification; Taiwan IC industry wants stockpiles; China poaches Taiwan ...

The number and variety of test interfaces, coupled with increased packaging complexity, are adding a slew of new challenges.

In the cloud, AI runs in a kind of computational luxury. Thousands of GPUs and CPUs sit in climate-controlled buildings with access to ample power and memory. Utilization may be inefficient—often just ...

Staying inside increasingly narrow process windows as specialty devices scale, diversify, and enter high-volume production.

As data rates continue to increase, maintaining reliable links requires careful coordination between the PHY and controller ...