The AI boom necessitates the development of next-generation GPU chips, high-bandwidth memory (HBM), and other advanced semiconductor technologies, ...

Summary The rise of advanced electronics packaging introduces security risks during assembly but creates opportunities for enhanced trust. Techniques like split manufacturing secure functionality ...

Nvidia CEO says its advanced packaging technology needs are changing: Summary Nvidia CEO Jensen Huang emphasized strong demand for advanced packaging from TSMC, driven by a shift ...

Summary The data center industry faces soaring energy costs and environmental challenges, with liquid cooling emerging as a vital solution for high-density computing. Despite safety, cost, and ...

Manish Raghavan, MIT professor and AI researcher, tackles algorithmic risks while leveraging AI to address societal issues. His work spans improving hiring practices, enhancing medical tools, and ...

Summary The semiconductor industry is poised for a revolutionary year in 2025, driven by demands for compute power, AI advancements, and architectural ...

Summary Taiwan Semiconductor Manufacturing Co (TSMC) projects a 25% revenue growth in 2025, driven by surging demand for AI chips, doubling last year’s AI revenue. Despite challenges like capacity ...

Competition intensifies over glass substrates for computer chips: Summary Competition intensifies in the race to commercialize glass substrates, a next-gen material poised to revo ...

Apple has worst day since August following reports of China, AI struggles: Summary Apple's stock plunged 4% on Thursday, its worst day since August, following reports of declining ...

Summary Google leveraged Siemens’ Calibre DesignEnhancer to tackle IR drop challenges in cutting-edge 3nm semiconductor designs, achieving a 30% reduction in IR drop hotspots. This automated, ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

StratEdge has been a leader in the design and production of high-performance semiconductor packages since 1985, with a focus on developing components for compound semiconductors. All our packages are ...