Fujifilm announced its plan to strengthen its business in materials for semiconductor back-end processes at a semiconductor materials business briefing held in Tokyo on July 15, 2025. The company aims ...

Hanmi Semiconductor has secured a major supply agreement with Taiwan's ASE Technology Holding Co., marking another strategic win in its global expansion drive. Under the contract, Hanmi will export ...

ASE Technology (NYSE:ASX) delivers semiconductor assembly, testing, and IC packaging services, supporting engineering, supply ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

Sunfort™ dry film photoresist is a mainstay of Asahi Kasei’s Electronics business, comprising electronic materials and components. The entity is positioned as a First Priority business to drive growth ...

Tokyo, Japan, December 9, 2025-- FUJIFILM Corporation announced the launch of “ZEMATES™*1,” a new brand of photosensitive insulating materials for semiconductor back-end processes, centered on ...

Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...

Partnership Supports Ainos' 2026 Strategic Focus on Advancing AI Nose Upstream and Accelerating Scent Data Accumulation in Advanced Wafer Fabs HOUSTON, TX / ACCESS Newswire / January 7, 2026 / Ainos, ...

TOKYO, Oct. 1, 2025 /PRNewswire/ -- Nikon Corporation is reaffirming the availability of its Digital Lithography System, DSP-100, with orders having commenced in July 2025. This system is specifically ...

TL;DR: Samsung Electronics has begun developing its next-generation 1nm process node, termed the "dream semiconductor process," requiring new technologies and High-NA EUV lithography. Mass production ...