A recent arrival for flip-chip RF modules is a copper pillar bump (see Figures 4.18 and 4.19). The main benefit is its improved thermal dissipation [30], as demonstrated in Chapter 3. However, the ...

This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. “With the continuous miniaturization of ...

A potential breakthrough technology from Nextreme (Research Triangle Park, NC)—a microscale thermal and power-management device manufacturer—integrates cooling and power-generation capabilities into ...

Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing ...

TAIPEI, Taiwan — Advanced Semiconductor Engineering Inc., a supplier of packaging and testing services, has said that it has electroplated wafer bumping technology on 200-mm wafers and has begun a ...

WILMINGTON, Mass.--(BUSINESS WIRE)-- Onto Innovation Inc. (NYSE: ONTO) today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di™ technology on the ...